00218-TI Electrostatic Discharge (ESD) Protective Semiconductor Packing Materials and Configurations
本文檔由 草廬一葦 分享于2011-03-09 21:52
The purpose of this application report is to describe in detail the methods used to test, evaluate, and deploy proper packing materials that protect against electrostatic discharge (ESD) damage to semiconductor devices. This application report provides customers with answers to the most frequently asked questions and allows them to review different ESD-protective packing con..